Soft soldering paste produced on the basis of flux according to DIN EN 29454,
fine-grained powder obtained from binders according to DIN EN 29453 and binder.
When soldering, soft solder should be additionally used.
Properties:
- easy removal of residues soluble in cold water by rinsing according to KIN 1988
- the paste does not delaminate, thus mixing the paste before use is unnecessary
- high work efficiency due to solder content
- operating temperature 227°C-310°C-
fine-grained powder obtained from binders according to DIN EN 29453 and binder.
When soldering, soft solder should be additionally used.
Properties:
- easy removal of residues soluble in cold water by rinsing according to KIN 1988
- the paste does not delaminate, thus mixing the paste before use is unnecessary
- high work efficiency due to solder content
- operating temperature 227°C-310°C-