Paste designed for soldering SMD elements in production processes that do not take into account the washing phases. Based on No Clean flux, does not require washing, the residues of which do not cause corrosion foci. The product works with all lead-free alloys, it is characterized by good adhesion and wettability of the soldered surface. It does not lose its physicochemical properties even after 20 hours of leaving it on the PCB. This time depends on the conditions prevailing in the room: humidity and temperature.
- contains flux based on rosin
- the presence of an activator that prevents the formation of air bubbles in the soldered joints
- these connections have very good mechanical and electrical properties.
If the process takes into account the washing phase, this can be done with commonly available means (Water PCB Remover, Alcohol PCB Remover).